| 摘要 |
PROBLEM TO BE SOLVED: To achieve a reduced size as well as highly efficient thermal control for boosting high performance.SOLUTION: A base section 12 provided with a working fluid supply section 321 having a working fluid supply-side connecting section 322 and a working fluid discharge-side connecting section 323 is stacked on an element housing section 31 of a package body 30 in which a semiconductor element 13 is housed. |
