| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of preventing deposition of a film forming material on the surface in a region except for a substrate on a substrate holder and improving quality and productivity of the film formed on the substrate.SOLUTION: The sputtering apparatus includes: a vacuum chamber 1 which can be evacuated; a substrate holder 40, which is arranged inside the vacuum chamber 1 and provided with holding mechanisms 30, 31 for holding a substrate 8 with the surface to be treated facing downward; a cathode electrode 10 to which electric power for discharge is supplied, disposed directly below the substrate holder 40 to face the substrate 8; and a target 16 supported in the substrate side of the cathode electrode 10. The substrate holder 40 includes heating mechanisms 60, 61 for heating the surface of a region excluding the substrate to a temperature equal to or higher than the decomposition or evaporation temperature of the film forming material for forming a film on the substrate 8. |
