发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device ensuring a magnetic shielding characteristic and a sealing resin filling property among those constituted to accommodate substrates and magnetic components under the condition that they are arranged in the thickness direction for a case having an aperture in the thickness direction and to embed the substrates and magnetic components using the sealing resin.SOLUTION: The electronic circuit device includes a magnetic flux generating region 55 where a magnetic component 5 generates a magnetic flux from a local area and a shielding plate 6 having a polygon-shape in plan view for shielding the magnetic flux disposed between the substrate and the magnetic component. The shielding plate is provided with an opening hole 63 at a position not overlapped with the magnetic flux generating region in the thickness direction of the case. The shape of the opening hole in plan view is shaped to have an angled portion 64 protruded to the external side. This angled portion is arranged on a virtual segment with the longest distance at least in the distance up to a side of the shielding plate from the center of the opening hole among a plurality of virtual segments extended to each side of the shielding plate from the center of the opening hole in plan view.
申请公布号 JP2011204867(A) 申请公布日期 2011.10.13
申请号 JP20100070135 申请日期 2010.03.25
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 ICHIKAWA MASATO
分类号 H05K9/00 主分类号 H05K9/00
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