发明名称 MANAGEMENT APPARATUS OF SOLDER
摘要 PROBLEM TO BE SOLVED: To provide a management apparatus of solder, by which a status of the use of solder is properly managed, so that an amount of wasted solder can be reduced.SOLUTION: The management apparatus of solder includes: an outgoing processing part 12 which, receiving an input of storing container identification information for identifying a container with solder beginning to be used contained and of place-to-use information for specifying a place where the solder is to be used, specifies a time to start using the solder, and which processes registration by collating the inputted storing container identification information, the place-to-use information, and the specified time to start using the solder; and an incoming processing part 13 which, receiving an input of the storing container identification information for identifying a container with the solder collected therein after completion of use, specifies a time to finish using the solder, and which processes renewal of the use time collated with the storing container identification information of the container with the solder collected contained on the basis of these pieces of information. As a result, the status of the use of the solder that is successively replenished is properly managed, thereby reducing the amount of wasted solder.
申请公布号 JP2011201203(A) 申请公布日期 2011.10.13
申请号 JP20100071956 申请日期 2010.03.26
申请人 PANASONIC CORP 发明人 TOMOMATSU MICHINORI;IKEDA MASANORI;TANIGUCHI MASAHIRO;FURUICHI SEI
分类号 B41F15/08 主分类号 B41F15/08
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