| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant of copper which improves the removal property of a seed layer in a manufacturing process of a substrate and, at the same time, hardly causes the undercutting when removing such a seed layer and to provide a method of manufacturing substrate using such an etchant.SOLUTION: The etchant of copper containing sulfuric acid and hydrogen peroxide is characterized by containing a benzotriazole compound having a nitro substituent and an organic amine compound. The method of manufacturing substrate using such an etchant is also provided. |
