发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the shape capable of suppressing disconnection and the like of a heating element, and further suppressing deformation of a holding body due to self weight and the like of the heating element.SOLUTION: This substrate treatment device includes a treatment chamber disposed in a heating chamber for treating a substrate, and a heating device for heating the inside of the heating chamber. The heating device includes the heating element 42 configured so that a plurality of peak sections 42a and trough sections 42b are lined respectively at upper and lower ends and its both ends are fixed, a heat insulator 33 configuring a part of the heating chamber and disposed on an outer periphery of the heating element 42, and a holding body 41 fixed to the heat insulator 33 and holding the heating element 42, at least a part of the peak sections 42a of the heating element 42 is bent to a heat insulator 33 side, and the heat insulator 33 includes a projecting section 51 projecting toward a heating element 42 side at a part opposing to the trough sections 42a of the heating element 42 and supporting the holding body 41.
申请公布号 JP2011202865(A) 申请公布日期 2011.10.13
申请号 JP20100069895 申请日期 2010.03.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MURATA HITOSHI;KOSUGI TETSUYA;SUGIURA SHINOBU
分类号 F27D11/02;C23C16/46;H01L21/205;H01L21/22;H01L21/31;H01L21/324 主分类号 F27D11/02
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