| 摘要 |
The present invention relates to a method for producing a conductor structural element, comprising the following steps: providing a rigid substrate (12), electrodepositing a copper coating (14) on the rigid substrate (12), applying a conductor pattern structure (16) to the copper coating (14), then possibly mounting components, laminating the substrate with at least one electrically insulating layer (24, 28), detaching the rigid substrate (12), at least partially removing the remaining copper coating (14) of the rigid substrate (12) in such a way that the conductor pattern structure (16, 14, 42) is exposed. |
