| 摘要 |
Disclosed is a method for manufacturing a heat-pipe-type heat-dissipating device. The method for manufacturing a heat-pipe-type heat-dissipating device comprises the following steps: winding a pipe into a spiral structure along a working frame to form a pipe loop; and pressing at least one portion of the outer circumference of the pipe loop such that the pipe loop is plastically deformed into a shape corresponding to the working frame. According to the method, the pipe loop comprises plastic deformed into a shape corresponding to the working frame through a pressing step, and therefore the shape of the pipe loop is maintained as is even after being separated from the working frame. |
