发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad allowing excellent end point detection without generating a scratch, when polishing a material to be polished of a metal film by detecting the end point, while supplying slurry to the polishing pad.SOLUTION: This polishing pad is constituted of a polishing layer 1, a cushion layer 4 and a window member 2. The window member 2 is prepared by polymer containing fluorine. The window member 2 includes a through hole having a maximum hole diameter of ≥0.01 mm and ≤0.1 mm from a front surface to a rear surface.
申请公布号 JP2011200962(A) 申请公布日期 2011.10.13
申请号 JP20100069763 申请日期 2010.03.25
申请人 TORAY IND INC 发明人 JO KUNIYOSHI;SUGIMURA MASAHIRO;IKETANI SHUICHI
分类号 B24B37/20;H01L21/304 主分类号 B24B37/20
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