发明名称 WIRING CIRCUIT BOARD FOR SURFACE-MOUNTING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board for a surface-mounting light emitting element, which increases an electrode routing flexibility and have a high light reflection factor and an excellent heat radiation efficiency, and also to provide a light emitting device.SOLUTION: The wiring circuit board for a surface-mounting light emitting element includes: an insulating base 3 made of ceramic and having a metallic member 1 passed therethrough; an upper surface insulating layer 5 which is laminated on the upper surface of the insulating base 3, has a mounting section 15 for mounting of a light emitting element 13 thereon, and is made of ceramic; and a connection electrode 7 formed on the upper surface of the upper surface insulating layer 5. The upper surface insulating layer 5 consists of: an upper dense part 5a; and an upper porous part 5b having a density lower than that of the upper dense part 5a. The mounting section 15 is positioned in the upper surface of the upper dense part 5a, and the upper dense part 5a is positioned in the upper surface of the metallic member 1.
申请公布号 JP2011205009(A) 申请公布日期 2011.10.13
申请号 JP20100072782 申请日期 2010.03.26
申请人 KYOCERA CORP 发明人 ARIKAWA HIDEHIRO;HASEGAWA TOMOHIDE;IZUMI MINAKO
分类号 H01L33/48;H01L33/64 主分类号 H01L33/48
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