| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an LED package which eliminates oozing-out of a sealing resin from a clearance between a case and a lead or reduces then amount thereof.SOLUTION: The method for manufacturing the LED package has a molding step of insert-molding a resin-made case 20 with a reflector 23, protruding from a circumference of an LED mounting part 21 for mounting LEDs 11 so as to expose each one end of a plurality of leads 16 onto the LED mounting part 21; a charging step of charging a thermosetting sealing resin 13 into space 22 surrounded by the LED mounting part 21 and the reflector 23, after the LEDs 11 are mounted on the LED mounting part 21; and a heating step of heating an extension part 18 of the lead 16, which penetrates the reflector 23 and extends outside of the case 20 after the charging step. A region 13b brought into contact with the lead 16 of the sealing resin 13 is cured at earlier times than the other regions by the heating step. |
