发明名称 FILAMENT BUNDLE GRASPING MECHANISM, APPARATUS AND METHOD FOR PRODUCING FILAMENT BUNDLE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for producing a filament bundle, which, in producing a filament bundle, prevents catch of filaments at a joint of a filament bundle cover, damage such as break or cut caused by the catch and reduction in quality of filament bundle and yield.SOLUTION: The filament bundle grasping mechanism includes covering at least a part of the outer peripheral surface of the filament bundle 1 obtained by bundling a prescribed number of filaments, handling the filament bundle in which the filament bundle guide surface of the filament bundle cover 3 in contact with the outer circumference of the filament bundle is contacted with and separated from the outer peripheral surface of the filament bundle in at least three directions toward approximately central directions.
申请公布号 JP2011202300(A) 申请公布日期 2011.10.13
申请号 JP20100069765 申请日期 2010.03.25
申请人 TORAY IND INC 发明人 TERASAKA HIROYUKI;FUJII KOHEI
分类号 D02J11/00;B01D63/02;D02G3/38 主分类号 D02J11/00
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