发明名称 SEED LAYER DEPOSITION IN MICROSCALE FEATURES
摘要 A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece: The method comprises providing a work piece with a barrier metal coating that is substantially uniform, and is applied by a substantially surface reaction limited process. The workpiece has a coating, on its planar surface, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located on the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath of metal ions, which fully contacts the interior surfaces of the microscale hole features. An electric potential is applied at the perimeter of the work piece to deposit metal ions onto all surfaces in one step.
申请公布号 WO2011126914(A1) 申请公布日期 2011.10.13
申请号 WO2011US30637 申请日期 2011.03.31
申请人 NEXX SYSTEMS, INC.;GOODMAN, DANIEL, L.;KEIGLER, ARTHUR;CHIU, JOHANNES;LIU, ZHENQIU 发明人 GOODMAN, DANIEL, L.;KEIGLER, ARTHUR;CHIU, JOHANNES;LIU, ZHENQIU
分类号 H01L21/768 主分类号 H01L21/768
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