| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device such that connections between a connection plate and leads are made excellent, and to provide a method of manufacturing the same.SOLUTION: The semiconductor device 10 includes an island 14, a semiconductor element 12 fixed to an upper surface of the island 14, the connection plate 16 etc., connecting the semiconductor element 12 to the respective leads, and sealing resin 38 covering them in a body, and is provided with a protrusion portion 28 formed by protruding an end of a lead (post 24) upward. Further, a lower surface of a first flat surface 16A of the connection plate 16 is arranged below an upper end portion of the protrusion portion 28. Consequently, movement during joining of the connection plate 16 is suppressed. |
