| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal filling fine structure having high filling factor of a metal to micropores provided in an insulating base material and preventing the occurrence of warpage of the fine structure due to the residual stress accompanying the filling of the metal.SOLUTION: The method of manufacturing a metal filling fine structure has: a step of filling the metal into through-holes in the insulating base material provided with the through-holes 101, 102 and the like having 10-5,000 nm average opening diameter, 10-1,000 μm average depth and 1×10-1×10/mmdensity by electroplating so that the virtual filling factor of the metal to the through-holes is larger than 100%; and a step of removing the metal stuck to the surface of the insulating base material, wherein the electroplating is carried out so that the difference of the crystal particle diameter of the metal filled into the inside of the through-holes and the crystal particle diameter of the metal stuck to the surface of the insulating base material is controlled to ≤20 nm. |
