| 摘要 |
The illuminating device structure contains a heat-dissipating base, a circuit board on a top side of the heat-dissipating base, and at least a naked, high-powered LED die on the circuit board. A hollow cover is configured on the heat-dissipating base to cover the LED die. A phosphor layer is coated on an interior wall of the cover and a space is thereby reserved between the phosphor layer and the LED die. As such, the phosphor layer is protected against the heat and high temperature from the LED die by the space and therefore would enjoy an extended operation life. |
