| 摘要 |
<p>In a semiconductor module (10) in which a semiconductor device (17) is mounted on both surfaces of a circuit board (11) and heat radiation plates (12a,12b) are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates (12a,12b) are fitted is formed in the circuit board (11), and a housing recess portion (18) in which the semiconductor devices (17) are housed is provided to both heat radiation plates (12a,12b) fitted to both surfaces of the circuit board (11) respectively and a fitting edge portion (25) is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means (20) for fixing both heat radiation plates (12a,12b) to the circuit board (11) by caulking to align with the fitting hole is provided to fitting edge portions (25) integrally with the heat radiation plates (12a,12b).</p> |
