发明名称 WIRELESS COMMUNICATION WITH A MEDICAL IMPLANT
摘要 <p>An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.</p>
申请公布号 EP2374183(A2) 申请公布日期 2011.10.12
申请号 EP20090771459 申请日期 2009.12.11
申请人 MICROCHIPS, INC. 发明人 UTSI, VINCENT;NORRIS, MARK;RICHERD, JEAN-DANIEL
分类号 H01Q1/27;H01Q1/38;H01Q5/00;H01Q9/04 主分类号 H01Q1/27
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