发明名称 |
WIRELESS COMMUNICATION WITH A MEDICAL IMPLANT |
摘要 |
<p>An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.</p> |
申请公布号 |
EP2374183(A2) |
申请公布日期 |
2011.10.12 |
申请号 |
EP20090771459 |
申请日期 |
2009.12.11 |
申请人 |
MICROCHIPS, INC. |
发明人 |
UTSI, VINCENT;NORRIS, MARK;RICHERD, JEAN-DANIEL |
分类号 |
H01Q1/27;H01Q1/38;H01Q5/00;H01Q9/04 |
主分类号 |
H01Q1/27 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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