| 摘要 |
A light emitting device module (120) is provided comprising a light emitting device package (122) and a board (124) including first and second dummy pads (101,105) and an electrode pad (102-104) arranged between the first and second dummy pads, on which the light emitting device package is disposed, wherein at least one of the first and second dummy pads has a dummy hole (101a-105a), and wherein the electrode pad adjacent to at least one of the first and second dummy pads has an electrode hole (102a-104a). |
