CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE

摘要

The present invention provides a method for manufacturing ceramic substrate having via hole (s) and a surface wiring pattern electrically connected to the via hole(s), the method comprising the steps of: preparing a sintered ceramic substrate having via hole (s) ; forming over the sintered ceramic substrate a sintered ceramic layer having hole(s) or opening(s) whose bottom is configured to be at least a part of exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion. According to the above method, even when the sintered ceramic substrate is manufactured by co-firing method, it is possible to highly accurately control the connecting position of the via hole(s) and the surface wiring pattern, but also possible to inhibit problems like short circuit. Thus, it is capable of forming a highly-accurate and fine wiring pattern on the ceramic substrate.