发明名称 |
Method for forming a multi-layer electrode underlying a piezoelectric layer and related structure |
摘要 |
According to an exemplary embodiment, a method of forming a multi-layer electrode for growing a piezoelectric layer thereon includes a step of forming a high conductivity metal layer over a substrate. The method further includes a step of forming a seed layer over the high conductivity metal layer. The method further includes a step of forming a high density metal layer over the seed layer. The method further includes a step of forming a piezoelectric layer over the high density metal layer. The high conductivity metal layer, the seed layer, and the high density metal layer form the multi-layer electrode on which the piezoelectric layer is grown.
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申请公布号 |
US8035277(B2) |
申请公布日期 |
2011.10.11 |
申请号 |
US20080221276 |
申请日期 |
2008.08.01 |
申请人 |
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE.LTD. |
发明人 |
BARBER BRADLEY P.;CARPENTER CRAIG E.;GEHLERT PAUL P.;SHEPARD CHRISTOPHER F. |
分类号 |
H01L41/08 |
主分类号 |
H01L41/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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