| 摘要 |
A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like“tub”formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or“tub”that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and/or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by“drawing”at least one of the parts against a“stop”surface.
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