发明名称 |
Method to recover patterned semiconductor wafers for rework |
摘要 |
Disclosed are embodiments of a method of removing patterned circuit structures from the surface of a semiconductor wafer. The method embodiments comprise blasting the surface of the semiconductor wafer with particles so as to remove substantially all of the patterned circuit structures. The blasting process is followed by one or more grinding, polishing and/or cleaning processes to remove any remaining circuit structures, to remove any lattice damage and/or to achieve a desired smoothness across the surface of the semiconductor wafer.
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申请公布号 |
US8034718(B2) |
申请公布日期 |
2011.10.11 |
申请号 |
US20080031726 |
申请日期 |
2008.02.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CODDING STEVEN R.;DOMINA DAVID;HARDY, JR. JAMES L.;KRYWANCZYK TIMOTHY C. |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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