发明名称 Neutralization of trapped charge in a charge accumulation layer of a semiconductor structure
摘要 A semiconductor structure. The semiconductor structure includes a semiconductor layer, a charge accumulation layer on top of the semiconductor layer, a doped region in direct physical contact with the semiconductor layer; and a device layer on and in direct physical contact with the charge accumulation layer. The charge accumulation layer includes trapped charges of a first sign. The doped region and the semiconductor layer forms a P−N junction diode. The P−N junction diode includes free charges of a second sign opposite to the first sign. The trapped charge in the charge accumulation layer exceeds a preset limit above which semiconductor structure is configured to malfunction. A first voltage is applied to the doped region. A second voltage is applied to the semiconductor layer. A third voltage is applied to the device layer. The third voltage exceeds the first voltage and the second voltage.
申请公布号 US8035200(B2) 申请公布日期 2011.10.11
申请号 US20100792837 申请日期 2010.06.03
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AITKEN JOHN M.;CANNON ETHAN HARRISON;STRONG ALVIN WAYNE
分类号 H01L29/786;H01L23/58;H01L23/62;H01L27/12 主分类号 H01L29/786
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