发明名称 |
Semiconductor device and semiconductor package including the same |
摘要 |
Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits. |
申请公布号 |
US8035194(B2) |
申请公布日期 |
2011.10.11 |
申请号 |
US20080347365 |
申请日期 |
2008.12.31 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE JUN-HO;LEE HYUNG-DONG;KIM HYUN-SEOK |
分类号 |
H01L29/417;H01L23/04;H01L23/50 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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