发明名称 Techniques for coupling in semiconductor devices
摘要 Techniques for exchange coupling of magnetic layers in semiconductor devices are provided. In one aspect, a semiconductor device is provided. The device comprises at least two magnetic layers, and a spacer layer formed between the magnetic layers, the spacer layer being configured to provide ferromagnetic exchange coupling between the layers, the magnetic layers experiencing anti-ferromagnetic dipole coupling, such that a net coupling of the magnetic layers is anti-ferromagnetic in a zero applied magnetic field. The semiconductor device may comprise magnetic random access memory (MRAM). In another aspect, a method for coupling magnetic layers in a semiconductor device comprising at least two magnetic layers and a spacer layer therebetween, the method comprises the following step. Ferromagnetic exchange coupling is provided of the magnetic layers, the magnetic layers experiencing anti-ferromagnetic dipole coupling, such that a net coupling of the magnetic layers is anti-ferromagnetic in a zero applied magnetic field.
申请公布号 US8034637(B2) 申请公布日期 2011.10.11
申请号 US20090539058 申请日期 2009.08.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 WORLEDGE DANIEL CHRISTOPHER
分类号 H01L21/30;H01F10/32;H01L43/08 主分类号 H01L21/30
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