发明名称 Structure for memory chip for high capacity memory subsystem supporting multiple speed bus
摘要 A design structure is provided for a memory module containing an interface for receiving memory access commands from an external source, in which a first portion of the interface receives memory access data at a first bus frequency and a second portion of the interface receives memory access data at a second different bus frequency. Preferably, the memory module contains a second interface for re-transmitting memory access data, also operating at dual frequency. The memory module is preferably used in a high-capacity memory subsystem organized in a tree configuration in which data accesses are interleaved. Preferably, the memory module has multiple-mode operation, one of which supports dual-speed buses for receiving and re-transmitting different parts of data access commands, and another of which supports conventional daisy-chaining.
申请公布号 US8037272(B2) 申请公布日期 2011.10.11
申请号 US20080053131 申请日期 2008.03.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BARTLEY GERALD K.;BORKENHAGEN JOHN M.;GERMANN PHILIP RAYMOND
分类号 G06F13/18 主分类号 G06F13/18
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