发明名称 Contact formation
摘要 The present disclosure includes various method of contact embodiments. One such method embodiment includes creating a trench in an insulator stack material of a particular thickness and having a portion of the trench positioned between two of a number of gates. This method includes depositing a filler material in the trench and etching the filler material to a particular depth that is less than the particular thickness of the insulator stack material. This method also includes depositing a spacer material to at least one side surface of the trench to the particular depth of the filler material and depositing a conductive material into the trench over the filler material.
申请公布号 US8034706(B2) 申请公布日期 2011.10.11
申请号 US20100787684 申请日期 2010.05.26
申请人 MICRON TECHNOLOGY, INC. 发明人 MATHEW JAMES;MANNING H. MONTGOMERY
分类号 H01L21/4763 主分类号 H01L21/4763
代理机构 代理人
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