| 摘要 |
The crystal oscillator device includes an air-tight case (1) forming a vacuum chamber (23), a piezoelectric resonator element (11), oscillation circuitry, a temperature sensor, and a heating unit implemented in an integrated-circuit (IC) chip (13) with an active surface (13a). The piezoelectric resonator element (11) and the oscillation circuitry are connected together to form an oscillation circuit. Furthermore, the temperature sensor and the heating unit are enclosed in the vacuum chamber (23) with the piezoelectric resonator element (11). The piezoelectric resonator element is attached in a heat conductive manner to the active surface (13a) of the integrated-circuit chip (13) in such a way that the IC chip provides mechanical support for the piezoelectric resonator element.
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