发明名称 Reliable interconnection
摘要 Embodiments relate to a method for forming reliable interconnects by the use of a device layer that can serve as a barrier or an etch stop layer, among other applications. The device layer is UV resistant in that its dielectric constant and stress remain stable or relatively stable when subjected to UV curing.
申请公布号 US8035201(B2) 申请公布日期 2011.10.11
申请号 US20090473232 申请日期 2009.05.27
申请人 GLOBALFOUNDRIES SINGAPORE PTE. LTD. 发明人 LIU HUANG;CHENG JACK;LU WEI;WANG YIHUA;ZHOU MEISHENG
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
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