| 摘要 |
[Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. [Means to Solve Problems] A Cu-Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu-Sn intermetallic compound layer 3 is composed of a Cu 3 Sn layer 5 arranged on the Ni-based base layer 2 and a Cu 6 Sn 5 layer 6 arranged on the Cu 3 Sn layer 5; the Cu-Sn intermetallic compound layer 3 obtained by bonding the Cu 3 Sn layer 5 and the Cu 6 Sn 5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 µm to 1.5 µm, the area coverage of the Cu 3 Sn layer 5 with respect to the Ni-based base layer 2 is 60% or higher, the ratio of the thicknesses of the projected portions 8 to the thicknesses Y of the recessed portions 7 in the Cu-Sn intermetallic compound layer 3 is 1.2 to 5, and the average thickness of the Cu 3 Sn layer 5 is 0.01 µm to 0.5 µm. |
