发明名称 HIGH FULL-WELL CAPACITY PIXEL WITH GRADED PHOTODETECTOR IMPLANT
摘要 Embodiments of a process for forming a photodetector region in a CMOS pixel by dopant implantation, the process comprising masking a photodetector area of a surface of a substrate for formation of the photodetector region, positioning the substrate at a plurality of twist angles, and at each of the plurality of twist angles, directing dopants at the photodetector area at a selected tilt angle. Embodiments of a CMOS pixel comprising a photodetector region formed in a substrate, the photodetector region comprising overlapping first and second dopant implants, wherein the overlap region has a different dopant concentration than the non-overlapping parts of the first and second implants, a floating diffusion formed in the substrate, and a transfer gate formed on the substrate between the photodetector and the transfer gate. Other embodiments are disclosed and claimed.
申请公布号 US2011241090(A1) 申请公布日期 2011.10.06
申请号 US20100755088 申请日期 2010.04.06
申请人 OMNIVISION TECHNOLOGIES, INC. 发明人 MAO DULI;TAI HSIN-CHIH;VENEZIA VINCENT;QIAN YIN;RHODES HOWARD E.
分类号 H01L31/112;H01L21/66 主分类号 H01L31/112
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