| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device whose miniaturization becomes easy and which is excellent in productivity, and to provide a method of manufacturing the same.SOLUTION: The power conversion device 1 accommodates a semiconductor stacked unit 4 structured by stacking semiconductor modules 2 and cooling tubes 3 in a frame 5. A pressing member 6 is arranged at one end of the stacking direction X of the semiconductor stacked unit. The pressing member 6 has a press contact plate 61, an engagement plate 62, which can rotate around a rotation axis A to the press contact plate, and a spring member 63 arranged between the press contact plate and the engagement plate. The frame has an insertion opening 51 at a position facing one end of the stacking direction of the semiconductor stacked unit. The engagement plate is larger than the width D of the insertion opening in the dimension L in the longitudinal direction and smaller than the width D in the dimension W in the short-side direction. In a state that the short-direction of the engagement plate intersects the width direction of the insertion opening, the engagement plate is engaged with the inner wall 52 of the frame at both sides of the width direction of the insertion opening. |
