发明名称 RAPIDLY DISSOLVING PROCESS FOR MICRONEEDLE
摘要 PROBLEM TO BE SOLVED: To provide a microneedle patch rapidly absorbed into a body and a method of using the same.SOLUTION: In the rapidly dissolving method for microneedle array, void holes are set in an adhesive tape stuck on the backside of the microneedle array, supplying moisture from the backside of the microneedle array, and rapidly swelling up and dissolving the microneedle array. Thereby the constituent of the microneedle is rapidly absorbed into a body. For the purpose of supplying moisture, lotion or cosmetic solution containing gauze, nonwoven fabric, or tape, or aqueous gel pack can be used. A time for dissolving the microneedle which has required 1 to 3 hours in the conventional methods, can be shortened to 10-30 minutes.
申请公布号 JP2011194189(A) 申请公布日期 2011.10.06
申请号 JP20100088144 申请日期 2010.03.19
申请人 KOSUMEDEI SEIYAKU KK 发明人 GON EISHUKU;KAMIYAMA FUMIO
分类号 A61M37/00 主分类号 A61M37/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利