| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device including a structure capable of suppressing degradation of adhesion force in a joint interface even when external force is applied to a member where two substrates are integrated.SOLUTION: Recessed parts 41 penetrating an interface 40 between a sensor part 10 and a cap part 20 are formed in a laminated body of the sensor part 10 and the cap part 20, and insulation films 42 and sealing circumferential metal layers 43 are arranged as sealing members in the recessed parts 41. According to this, the sealing members 42, 43 arranged in the recessed parts 41 become shields, and thereby external force is not directly transmitted to the interface 40 on the inner side relative to the recessed parts 41. Accordingly, degradation of adhesion force between the semiconductor substrate 10 and the sticking substrate 20 is suppressed. |
