| 摘要 |
A method for manufacturing a piezoelectric device comprising steps of preparing a base wafer (S122, S124) having a plurality of bases having a first bonding film formed on surrounding of the bases and first dents (66) formed adjacent to and contacted to the first bonding film; preparing a lid wafer (S102, S104) having a plurality of lids having a second bonding film formed on surrounding of the lid and the second dents (67) formed adjacent to and contacted to the second bonding film; mounting a bonding material (75) on the first dents (66) or the second dents (67); and bonding (S152) the base wafer and the lid wafer by solidifying the bonding material after melting the bonding material and flowing the molten material along the first bonding film and the second bonding film.
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