| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology of evaluating a semiconductor chip solving a problem wherein it cannot be heated during an evaluation test.SOLUTION: This semiconductor chip is formed by stacking, on one surface of a silicon substrate, at least one of a metal wiring film 101 as a resistance temperature sensing element consisting of a plurality of regions and a metal wiring film 102 as a heater consisting of one or a plurality of regions, and an electrode 103 for connecting the metal wiring film 101 and metal wiring film 102 to a mounting substrate. The semiconductor chip is mounted to the mounting substrate, and the metal wiring film 101 is electrically connected to an ammeter and voltmeter and the metal wiring film 102 is electrically connected to a power supply. Thus, the evaluation system capable of evaluating the temperature sensing, heating, and the temperature profile in each region of the semiconductor chip is provided. |
