| 摘要 |
PROBLEM TO BE SOLVED: To provide a package which is suited to height reduction and reliably secures a probe contact surface even when miniaturized.SOLUTION: The package 11 provided with a base substrate 12 on which an area for mounting a vibrating piece 110 and an area for mounting an IC chip 114 are arranged side by side horizontally, includes a vibrating piece-mounting pad 24 for mounting the vibrating piece 110 onto one surface of the base substrate 12, a vibrating piece-connecting first pad 36 (vibrating piece-connecting second pad 38) electrically connected to the vibrating piece-mounting pad 24, a Vc pad 40 (Vdd pad 42) electrically connected to a mounting terminal formed on the other surface of the base substrate 12, and a cutting pattern 66(68) for electrically connecting the vibrating piece-connecting first pad 36 and the Vc pad 40. |
