| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition especially having copper foil adhesiveness, low thermal expansion and high glass transition temperature, and achieving excellent low dielectric properties, solder heat resistance, heat resistance with copper, flame retardancy and drill processability, and to provide a prepreg and a laminated board using the composition.SOLUTION: There are provided the bismaleimide derivative represented by formula (I), the method for producing the derivative, the thermosetting resin composition containing the bismaleimide derivative, the prepreg and the laminated board. In the formula, Aris a residue represented by formula (I-1), (I-2), (I-3) or (I-4) (each not shown); Aris a residue represented by formula (I-5) or (I-6) (each not shown); Ris a hydroxy, carboxy or sulfonic acid group of an acidic substituent; Ris hydrogen, 1C-5C aliphatic hydrocarbon or halogen; x is an integer of 1-5; y is an integer of 0-4; with the proviso that the total of x and y is 5; and n is 0 or a positive number. |
