发明名称 |
Electronic Device and Manufacturing Method |
摘要 |
A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers.
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申请公布号 |
US2011241218(A1) |
申请公布日期 |
2011.10.06 |
申请号 |
US20100750946 |
申请日期 |
2010.03.31 |
申请人 |
MEYER THORSTEN;LEUSCHNER RAINER;OFNER GERALD;HESS REINHARD;SEZI RECAI |
发明人 |
MEYER THORSTEN;LEUSCHNER RAINER;OFNER GERALD;HESS REINHARD;SEZI RECAI |
分类号 |
H01L23/48;H01L21/78;H01L21/98;H01L23/488 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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