| 发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defect such as a crack from being generated when press-bonding an FPC to a device after transferred to a flexible substrate having flexibility such as a plastic film substrate.SOLUTION: A layer 405a including a circuit having an element, and a terminal electrode 405b are formed as a transferring layer to be separated, and a resin protection layer 405c is formed thereon to prevent the crack. An electrode face of the terminal electrode is exposed in a portion connected with the FPC. The FPC 407 is press-bonded to be connected by an anisotropic conductive film 406. A wire is protected by the protection layer 405c in the press-bonding process to prevent thereby the crack from being generated due to pressurization deformation. |
| 申请公布号 |
JP2011197696(A) |
申请公布日期 |
2011.10.06 |
| 申请号 |
JP20110134989 |
申请日期 |
2011.06.17 |
| 申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
GOTO YUGO;FUKUMOTO YUMIKO;TAKAYAMA TORU;MARUYAMA JUNYA;TSURUME TAKUYA |
| 分类号 |
G09F9/00;H01L29/786;H01L21/02;H01L21/336;H01L21/762;H01L21/77;H01L21/84;H01L27/12;H01L27/32;H01L51/52;H01L51/56 |
主分类号 |
G09F9/00 |
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