| 摘要 |
PROBLEM TO BE SOLVED: To appropriately suppress mutual interaction between an inductor element and wiring on its upper part on the same chip.SOLUTION: The semiconductor device has a semiconductor substrate 1 and a multilayered wiring layer formed on the semiconductor substrate 1. The multilayered wiring layer has the inductor element 10, wiring 11A, 11C, and 12 formed on the upper part of the inductor element 10, and shielding conductors 13, 14 having fixed potential between the inductor element 10 and the wiring 11A, 11C, and 12 on the inductor element, and covering the inductor element 10 in a planar view. |
