发明名称 ATOMIC-LAYER DEPOSITION APPARATUS AND ATOMIC-LAYER DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an atomic-layer deposition apparatus which can shorten a treatment period of time while suppressing the fluctuation of a film quality.SOLUTION: This apparatus includes: a substrate-supporting part 220 for supporting a plurality of substrates; a heating part 230 for heating a plurality of the substrates from the perimeter of the substrate-supporting part; three gas supply parts 300, 320 and 340 for supplying a gas for forming a thin film, which are arranged so as to be separated from each other in the direction perpendicular to the substrate; three temperature-adjusting parts 306, 326 and 346 for adjusting the temperature of the gas supplied from the gas supply parts; and a temperature-controlling part for individually controlling the temperature-adjusting parts. The respective gas supply parts include source gas supply pipes 302, 322 and 342 for supplying the source gas, and reaction gas supply pipes 304, 324 and 344 for supplying the reaction gas. The temperature-controlling part controls the temperature-adjusting parts so that the temperature of the gas supplied from the gas supply part located in the central side among three gas supply parts becomes higher than that of the gases supplied from the gas supply parts located in the surrounding sides.
申请公布号 JP2011195863(A) 申请公布日期 2011.10.06
申请号 JP20100061972 申请日期 2010.03.18
申请人 MITSUI ENG & SHIPBUILD CO LTD 发明人 WASHIO YOSHIAKI
分类号 C23C16/455;C23C16/46;H01L21/31 主分类号 C23C16/455
代理机构 代理人
主权项
地址