METHOD OF MANUFACTURING SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR WAFER, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor wafer by which yields are significantly improved.SOLUTION: The method of manufacturing a semiconductor wafer includes a protection film forming step of forming a stripe-shaped protection film 302 on a part on a substrate 301, and a semiconductor layer forming step of forming a semiconductor layer by growing semiconductor crystal on a portion except for a protection film 302 forming portion of the substrate 301. A substrate which satisfies that an absolute value |θp| of an off angle θp in a direction parallel to a length direction of the protection film 302 is smaller than an absolute value |θo| of an off angle θo in a direction orthogonal to the length direction of the protection film 302, and |θp| ≤0.2°, is used as the substrate 301.