发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To achieve a thermal-expansion compensation structure that is mounted inside a cooling plate so as to prevent breakage of the cooling plate, even if a volume change occurs due to thermal expansion about cooling water inside the cooling plate for cooling an electronic apparatus.SOLUTION: An electronic apparatus includes a cooling plate; a circuit board mounted on the cooling plate; a heat-generating element fixed to the circuit board; a cooling-water-inlet-side coupler mounted on the cooling plate; a cooling-water-outlet-side coupler mounted on the cooling plate; a cooling-water flow path provided inside the cooling plate; cooling water filled in the cooling-water flow path; a capillary provided so as to communicate with the cooling-water flow path and to allow cooling water to pass therethrough; an elastic body held inside the capillary; and an air reservoir surrounded by the capillary and the elastic body.
申请公布号 JP2011198803(A) 申请公布日期 2011.10.06
申请号 JP20100060737 申请日期 2010.03.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUKADA TAKASHI;KOBAYASHI YUTAKA
分类号 H05K7/20 主分类号 H05K7/20
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