| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound surface grinding apparatus, capable of reducing grinding time of a material to be ground.SOLUTION: In the compound surface grinding apparatus 1, the surface of the material to be ground mounted on a work table 31 that reciprocally moves in a right and left direction is arranged on a vertical plane including the center point 31c of the work table, a diameter direction of a first grinding wheel 26a, and a diameter direction of a second grinding wheel 26b, the grinding wheels 26a, 26b are arranged at positions where the center point 31c of the work table is at an equal distance from a center point 25a of a first grinding shaft and a center point 25b of a second grinding shaft in a waiting position when starting grinding, and a workpiece support device 33 with a work axis tilt mechanism is mounted on the work table 31. The replacement of the grinding wheels is not required so that the grinding time is reduced. A workpiece is tilted by the tilt mechanism 32, thereby enabling V-groove grinding and R surface grinding. |
