RESIN COMPOSITION, RESIN SHEET, METHOD FOR PRODUCING RESIN SHEET, AND LAMINATED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition giving a cured product excellent in heat dissipation and heat resistance, and a resin sheet.SOLUTION: The resin composition contains: a radically polymerizable compound (A) having a carbon-carbon double bond and a weight-average molecular weight of 1,000 or less; a photoradical generator (B); and a curable compound (C) not having a carbon-carbon double bond but having an epoxy group or an oxetane group and a weight-average molecular weight of 600 or less; a thermal curing agent (D); and a filler (E) having thermal conductivity of 10 W/m K or more. The content of the radically polymerizable compound (A) is 20-60 wt.% and the content of the curable compound (C) is 10-60 wt.% of the total 100 wt.% of the whole resin component in the resin composition. The resin sheet is obtained by proceeding curing of the resin composition by polymerizing the radically polymerizable compound (A) so as to form insoluble gel or obtain the weight-average molecular weight of 10,000 or more.