发明名称 Silicide Contact Formation
摘要 A method for forming a silicide contact includes depositing a metal layer on silicon such that the metal layer intermixes with the silicon to form an intermixed region on the silicon; removing an unintermixed portion of the metal layer from the intermixed region; and annealing the intermixed region to form a silicide contact on the silicon. A semiconductor device comprising a silicide contact located over a silicon layer of the semiconductor device, the silicide contact comprising nickel (Ni) and silicon (Si) and having Ni amount equivalent to a thickness of about 21 angstroms or less.
申请公布号 US2011241213(A1) 申请公布日期 2011.10.06
申请号 US20100754912 申请日期 2010.04.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;GLOBAL FOUNDRIES INC. 发明人 KELLOCK ANDREW J.;LAVOIE CHRISTIAN;OZCAN AHMET;ROSSNAGEL STEPHEN;YANG BIN;ZHANG ZHEN;ZHU YU;ZOLLNER STEFAN
分类号 H01L23/532;H01L21/768 主分类号 H01L23/532
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