| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for bonding an electronic component which is excellent in storage stability, excellent in the adhesion of the electronic component and can form a hardened substance with a low water absorption rate.SOLUTION: The adhesive film for bonding an electronic component contains an epoxy compound, a reactive polymer compound having a functional group capable of reacting with the epoxy compound, an acid-anhydride-based hardening agent and a benzoxazine compound. A mixture amount of the benzoxazine compound ranges from 1-30 pts.wt. for a total of 100 pts.wt. of the epoxy compound and the reactive polymer compound having the functional group capable of reacting with the epoxy compound. |
