| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor having a high adhesiveness to an adhering part even in a case of having been subjected to a severe condition and a reflow process, an adhesive sheet for the semiconductor including an adhesive layer made of the adhesive composition, and a method of manufacturing the semiconductor using the same.SOLUTION: The adhesive composition for the semiconductor includes (A) an acrylic copolymer containing 3-10 wt.% structural unit derived from hydroxy-containing (meth)acrylic acid ester, and having a weight-average molecular weight of 100,000 to 1000,000, (B) an epoxy thermosetting resin, and (C) a thermosetting agent. |
